How do I avoid chipping in the ceramic?

Avoid contamination of the coping. Chips in the ceramic may occur when there is no bonding layer. Ensure the framework is designed appropriately and provides support for the ceramic. Ensure to apply a thin layer of dentine as a bonding agent as ZrPro® Ceram does not require the use of a Liner layer. The CTE of the framework should be within the indicated range.

The firing parameters must be adhered to including drying temperature, drying time, heating time, heating rate, firing temperature, holding time, cooling time, cooling temperature, vacuum start temperature and vacuum end temperature. Ceramic cracks can occur when the drying time is shortened, or a fast-heating rate is used and therefore must be avoided. The furnace must be void from contaminants and cleaned well before application.

Incisal cracks may occur when a thick dentine layer is applied and/or when the cooling time is too short and/or a coping design that is insufficient and too small. This can be avoided by applying an appropriate dentine layer, extending cooling times and designing an appropriate coping.